CyberOptics® MRS-Enabled SQ3000™ Multi-Function System is Adopted for Inspection and Metrology of Rohinni’s Micro LED Technology
August 01, 2019 at 16:30 PM EDT
CyberOptics Corporation (Nasdaq: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, today announced that CyberOptics’ Multi-Reflection Suppression (MRS)-Enabled SQ3000 multi-function system for Automated Optical Inspection (AOI), Solder Paste Inspection (SPI) and Coordinate Measurements (CMM) is being used for the inspection and measurement of proprietary Rohinni micro LED-based technology.
Micro LEDs developed using Rohinni’s technology can be deployed in consumer electronic devices, automotive applications and outdoor signage, among other applications. The disruptive technology enables products that are brighter, thinner, lighter and more dynamic than those currently on the market, with lower power consumption than LCD or OLED.
CyberOptics’ SQ3000 multi-function system is used for six critical in-line production process locations including incoming quality inspection of the flexible circuits, solder paste inspection, pre and post reflow AOI, coordinate measurements post placement of the LED die and final test.
“We are happy to use the SQ3000 in our line solution to inspect various process steps because of its higher speed, higher resolution and higher accuracy with the in-line CMM capability,” said Matthew Gerber, CEO, Rohinni. “The unmatched performance and versatility of the system make it the perfect solution for our challenging application needs and stringent quality requirements.”
“We are pleased to be chosen for the inspection and metrology of Rohinni’s disruptive micro LED technology,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “The innovation behind this flexible and thin lighting technology is extraordinary.”
The 3D SQ3000 all-in-one system can identify critical defects and measure critical parameters, providing a superior process control solution to improve yields, quality and operational efficiencies in manufacturing facilities. In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. The world’s first high speed, in-line CMM includes an extensive software suite for metrology grade measurement on all critical points.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 3D CMM system, products for semiconductor wafer level and advanced packaging inspection and metrology and CyberGage360 product; costly and time consuming litigation with third parties related to intellectual property infringement; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.